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Samyon HMP-200 全自动双面研磨机 (200mm)

Purpose:

It is used for cutting plane smooth on both ends of the samples, after making high precision specimens.

 

Technical parameters:

Max grinding height:200mm

Diamond grinding:Φ200mm

Working form: Automatic double-sided plane grind

Exterior dimension:1450x1360x1270mm

Details


  • 质量承诺
  • 正品保修
  • 送货到家
  • 交易简单化

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