PACEWORLDWIDE IR 3000 钻床 (无钻头) (không cần dùng đầu típ)

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IR 3000 Infrared BGA Rework System

Production BGA Installation & Rework WITHOUT the Expensive Nozzles!

The IR 3000 is the most advanced BGA rework system available on the market today. It can easily install and remove BGA, QFN, µBGA/CSP, Flip Chip and other SMD. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3000 does not require heat-focusing nozzles, saving you thousands in additional costs. Instead, it uses a unique aperture system to control and precisely apply the heat to protect adjacent components. Using a high quality, specially developed IR thermal sensor, the process is completely closed loop temperature controlled using non-contact measuring methods. Sodr-Cam Reflow Process Observation Camera allows you to watch the entire reflow process happen in real time.

Operator-Friendly Software ... Thermal Profiling Made Easy

The IR 3000  fully integrated software and step-by-step instructions makes profiling incredibly simple for even the most advanced BGA and CSP applications. The software is unique in that it uses PACE-exclusive, custom developed, PID controllers to control user determined ramp rates by selecting the time and the end temperature for each phase and provides intuitive set-up, multi-stage profiling, On-the-Fly profile adjustment, flux-dipping, and much more.

PACE Exclusive Height Adjustable Bottom-Side Preheater

The bottom preheater features an incredibly efficient, high power, quick response quartz IR emitter that is adjustable when more power is required for high thermal mass applications. The preheater can be adjusted from its standard position up to 38mm (1.5") closer to the PCB for those applications where additional heat is desired or needed! This is a unique PACE feature designed especially for use with Lead-Free processes and your highest-mass, heat-sinking PCB!

Advanced Features

Non-Contact IR Thermal Sensor

For added verification, a closed-loop, non-contact IR Temperature Sensor monitors and controls the ramp-up and temperature of the component in real time, by controlling the top heater output throughout the heating process.

 

 

 

Sodr-Cam Reflow Process Observation Camera

With its high-resolution, zoom and lighting features, Sodr-Cam allows the operator to view the entire reflow process, including the exact moment of solder melt! Sodr-Cam is on a movable extension arm that provides great flexibility.

 

 

 

Vision Overlay System (VOS) for Precision Optical Alignment

The Vision Overlay System uses a beam splitting prism for simultaneous view of PCB pads and component balls, and features a high resolution, color digital camera with PC controlled 72x zoom, focus, auto-focus, and lighting control.

 

 

 

Active Cooling Fan

During the Cool-Down Phase of a profile, the Active Cooling Fan automatically delivers controlled, active cooling of component and PCB, lessening the risk of excessive intermetallic growth and yielding high quality solder joints.

 

 

 

Automated Flux Dipping Tray

If flux dipping is needed, the part can be automatically dipped in gel or paste flux. Flux dipping adds a precise amount of flux to balls of a BGA, preventing the excessive solder voiding that occurs when too much flux is applied.

 

 

 

Precision PCB Holder

Features precision micrometer X & Y adjustments for the most delicate alignment (Theta control is on Reflow Head). Board holder arms with movable clamps provide support for the most irregularly shaped boards with unusual edges.

 

 

 

Adjustable Component Centering Nest

A removable and adjustable Component Nest is provided for perfect centering of components, in preparation for vacuum pick-up/placement.  The part is lifted to the proper height above the optics, ready to be aligned to the PCB.

 

 

 

Vacuum Picks

The system comes with 6 different size vacuum picks to handle a wide range of components as well as a selection of O-rings for irregularly surfaced components. An optional 20 gauge Micro Vacuum Pick is also available.