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Suneast CBD2200 IC Bonder

Placement accuracy:        ±10um@3σ

Placement angle accuracy:        ±0.3°@3σ

Loading mode:        Wafer box

Die size(mm):        0.25*0.25mm-10*10mm

PCB size(mm):        L300*W100

Placement head:        0-360°rotation/Auto change nozzle(option)

Placement pressure(N):        30-500g

Glue feeding mode:        Support: dispensing, dipping, painting

Core motion module:        Linear motor + grating scale

Platform base of machine:        Marble platform

Machine dimension(L×W×H):        1610mm×1380mm×1620mm

*Remarks: Customization is supported

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